<p style="MARGIN: 0px"> 1 </p> <p style="MARGIN: 0px">Electrons and Holes in Semiconductors 1</p> <p style="MARGIN: 0px">1.1 Silicon Crystal Structure 1</p> <p style="MARGIN: 0px">1.2 Bond Model of Electrons and Holes 4</p> <p style="MARGIN: 0px">1.3 Energy Band Model 8</p> <p style="MARGIN: 0px">1.4 Semiconductors, Insulators, and Conductors 11</p> <p style="MARGIN: 0px">1.5 Electrons and Holes 12</p> <p style="MARGIN: 0px">1.6 Density of States 15</p> <p style="MARGIN: 0px">1.7 Thermal Equilibrium and the Fermi Function 16</p> <p style="MARGIN: 0px">1.8 Electron and Hole Concentrations 19</p> <p style="MARGIN: 0px">1.9 General Theory of n and p 25</p> <p style="MARGIN: 0px">1.10 Carrier Concentrations at Extremely High and Low Temperatures 28</p> <p style="MARGIN: 0px">1.11 Chapter Summary 29</p> <p style="MARGIN: 0px">PROBLEMS 30</p> <p style="MARGIN: 0px">REFERENCES 33</p> <p style="MARGIN: 0px">GENERAL REFERENCES 34</p> <p style="MARGIN: 0px"> 2 </p> <p style="MARGIN: 0px">Motion and Recombination of Electrons and Holes 35</p> <p style="MARGIN: 0px">2.1 Thermal Motion 35</p> <p style="MARGIN: 0px">2.2 Drift 38</p> <p style="MARGIN: 0px">2.3 Diffusion Current 46</p> <p style="MARGIN: 0px">2.4 Relation Between the Energy Diagram and V, _ 47</p> <p style="MARGIN: 0px">2.5 Einstein Relationship Between D and μ 48</p> <p style="MARGIN: 0px">2.6 Electron—Hole Recombination 50</p> <p style="MARGIN: 0px">2.7 Thermal Generation 52</p> <p style="MARGIN: 0px">2.8 Quasi-Equilibrium and Quasi-Fermi Levels 52</p> <p style="MARGIN: 0px">2.9 Chapter Summary 54</p> <p style="MARGIN: 0px">PROBLEMS 56</p> <p style="MARGIN: 0px">REFERENCES 58</p> <p style="MARGIN: 0px">GENERAL REFERENCES 58</p> <p style="MARGIN: 0px">3 </p> <p style="MARGIN: 0px">Device Fabrication Technology 59</p> <p style="MARGIN: 0px">3.1 Introduction to Device Fabrication 60</p> <p style="MARGIN: 0px">3.2 Oxidation of Silicon 61</p> <p style="MARGIN: 0px">3.3 Lithography 64</p> <p style="MARGIN: 0px">3.4 Pattern Transfer–Etching 68</p> <p style="MARGIN: 0px">3.5 Doping 70</p> <p style="MARGIN: 0px">3.6 Dopant Diffusion 73</p> <p style="MARGIN: 0px">3.7 Thin-Film Deposition 75</p> <p style="MARGIN: 0px">3.8 Interconnect–The Back-End Process 80</p> <p style="MARGIN: 0px">3.9 Testing, Assembly, and Qualification 82</p> <p style="MARGIN: 0px">3.10 Chapter Summary–A Device Fabrication Example 83</p> <p style="MARGIN: 0px">PROBLEMS 85</p> <p style="MARGIN: 0px">REFERENCES 87</p> <p style="MARGIN: 0px">GENERAL REFERENCES 88</p> <p style="MARGIN: 0px"> 4 </p> <p style="MARGIN: 0px">PN and Metal—Semiconductor Junctions 89</p> <p style="MARGIN: 0px">Part I: PN Junction 89</p> <p style="MARGIN: 0px">4.1 Building Blocks of the PN Junction Theory 90</p> <p style="MARGIN: 0px">4.2 Depletion-Layer Model 94</p> <p style="MARGIN: 0px">4.3 Reverse-Biased PN Junction 97</p> <p style="MARGIN: 0px">4.4 Capacitance-Voltage Characteristics 98</p> <p style="MARGIN: 0px">4.5 Junction Breakdown 100</p> <p style="MARGIN: 0px">4.6 Carrier Injection Under Forward Bias–Quasi-Equilibrium Boundary Condition 105</p> <p style="MARGIN: 0px">4.7 Current Continuity Equation 107</p> <p style="MARGIN: 0px">4.8 Excess Carriers in Forward-Biased PN Junction 109</p> <p style="MARGIN: 0px">4.9 PN Diode IV Characteristics 112</p> <p style="MARGIN: 0px">4.10 Charge Storage 115</p> <p style="MARGIN: 0px">4.11 Small-Signal Model of the Diode 116</p> <p style="MARGIN: 0px">Part II: Application to Optoelectronic Devices 117</p> <p style="MARGIN: 0px">4.12 Solar Cells 117</p> <p style="MARGIN: 0px">4.13 Light-Emitting Diodes and Solid-State Lighting 124</p> <p style="MARGIN: 0px">4.14 Diode Lasers 128</p> <p style="MARGIN: 0px">4.15 Photodiodes 133</p> <p style="MARGIN: 0px">Part III: Metal—Semiconductor Junction 133</p> <p style="MARGIN: 0px">4.16 Schottky Barriers 133</p> <p style="MARGIN: 0px">4.17 Thermionic Emission Theory 137</p> <p style="MARGIN: 0px">4.18 Schottky Diodes 138</p> <p style="MARGIN: 0px">4.19 Applications of Schottky Diodes 140</p> <p style="MARGIN: 0px">4.20 Quantum Mechanical Tunneling 141</p> <p style="MARGIN: 0px">4.21 Ohmic Contacts 142</p> <p style="MARGIN: 0px">4.22 Chapter Summary 145</p> <p style="MARGIN: 0px">PROBLEMS 148</p> <p style="MARGIN: 0px">REFERENCES 156</p> <p style="MARGIN: 0px">GENERAL REFERENCES 156</p> <p style="MARGIN: 0px">5 </p> <p style="MARGIN: 0px">MOS Capacitor 157</p> <p style="MARGIN: 0px">5.1 Flat-Band Condition and Flat-Band Voltage 158</p> <p style="MARGIN: 0px">5.2 Surface Accumulation 160</p> <p style="MARGIN: 0px">5.3 Surface Depletion 161</p> <p style="MARGIN: 0px">5.4 Threshold Condition and Threshold Voltage 162</p> <p style="MARGIN: 0px">5.5 Strong Inversion Beyond Threshold 164</p> <p style="MARGIN: 0px">5.6 MOS C—V Characteristics 168</p> <p style="MARGIN: 0px">5.7 Oxide Charge–A Modification to Vfb and Vt 172</p> <p style="MARGIN: 0px">5.8 Poly-Si Gate Depletion–Effective Increase in Tox 174</p> <p style="MARGIN: 0px">5.9 Inversion and Accumulation Charge-Layer Thicknesses</p> <p style="MARGIN: 0px">–Quantum Mechanical Effect 176</p> <p style="MARGIN: 0px">5.10 CCD Imager and CMOS Imager 179</p> <p style="MARGIN: 0px">5.11 Chapter Summary 184</p> <p style="MARGIN: 0px">PROBLEMS 186</p> <p style="MARGIN: 0px">REFERENCES 193</p> <p style="MARGIN: 0px">GENERAL REFERENCES 193</p> <p style="MARGIN: 0px">6 </p> <p style="MARGIN: 0px">MOS Transistor 195</p> <p style="MARGIN: 0px">6.1 Introduction to the MOSFET 195</p> <p style="MARGIN: 0px">6.2 Complementary MOS (CMOS) Technology 198</p> <p style="MARGIN: 0px">6.3 Surface Mobilities and High-Mobility FETs 200</p> <p style="MARGIN: 0px">6.4 MOSFET Vt, Body Effect, and Steep Retrograde Doping 207</p> <p style="MARGIN: 0px">6.5 QINV in MOSFET 209</p> <p style="MARGIN: 0px">6.6 Basic MOSFET IV Model 210</p> <p style="MARGIN: 0px">6.7 CMOS Inverter–A Circuit Example 214</p> <p style="MARGIN: 0px">6.8 Velocity Saturation 219</p> <p style="MARGIN: 0px">6.9 MOSFET IV Model with Velocity Saturation 220</p> <p style="MARGIN: 0px">6.10 Parasitic Source-Drain Resistance 225</p> <p style="MARGIN: 0px">6.11 Extraction of the Series Resistance and the Effective Channel Length 226</p> <p style="MARGIN: 0px">6.12 Velocity Overshoot and Source Velocity Limit 228</p> <p style="MARGIN: 0px">6.13 Output Conductance 229</p> <p style="MARGIN: 0px">6.14 High-Frequency Performance 230</p> <p style="MARGIN: 0px">6.15 MOSFET Noises 232</p> <p style="MARGIN: 0px">6.16 SRAM, DRAM, Nonvolatile (Flash) Memory Devices 238</p> <p style="MARGIN: 0px">6.17 Chapter Summary 245</p> <p style="MARGIN: 0px">PROBLEMS 247</p> <p style="MARGIN: 0px">REFERENCES 256</p> <p style="MARGIN: 0px">GENERAL REFERENCES 257</p> <p style="MARGIN: 0px"> 7 </p> <p style="MARGIN: 0px">MOSFETs in ICs–Scaling, Leakage, and Other Topics 259</p> <p style="MARGIN: 0px">7.1 Technology Scaling–For Cost, Speed, and Power Consumption 259</p> <p style="MARGIN: 0px">7.2 Subthreshold Current–“Off” Is Not Totally “Off” 263</p> <p style="MARGIN: 0px">7.3 Vt Roll-Off–Short-Channel MOSFETs Leak More 266</p> <p style="MARGIN: 0px">7.4 Reducing Gate-Insulator Electrical Thickness and Tunneling Leakage 270</p> <p style="MARGIN: 0px">7.5 How to Reduce Wdep 272</p> <p style="MARGIN: 0px">7.6 Shallow Junction and Metal Source/Drain MOSFET 274</p> <p style="MARGIN: 0px">7.7 Trade-Off Between Ion and Ioff and Design for Manufacturing 276</p> <p style="MARGIN: 0px">7.8 Ultra-Thin-Body SOI and Multigate MOSFETs 277</p> <p style="MARGIN: 0px">7.9 Output Conductance 282</p> <p style="MARGIN: 0px">7.10 Device and Process Simulation 283</p> <p style="MARGIN: 0px">7.11 MOSFET Compact Model for Circuit Simulation 284</p> <p style="MARGIN: 0px">7.12 Chapter Summary 285</p> <p style="MARGIN: 0px">PROBLEMS 286</p> <p style="MARGIN: 0px">REFERENCES 288</p> <p style="MARGIN: 0px">GENERAL REFERENCES 289</p> <p style="MARGIN: 0px">8 </p> <p style="MARGIN: 0px">Bipolar Transistor 291</p> <p style="MARGIN: 0px">8.1 Introduction to the BJT 291</p> <p style="MARGIN: 0px">8.2 Collector Current 293</p> <p style="MARGIN: 0px">8.3 Base Current 297</p> <p style="MARGIN: 0px">8.4 Current Gain 298</p> <p style="MARGIN: 0px">8.5 Base-Width Modulation by Collector Voltage 302</p> <p style="MARGIN: 0px">8.6 Ebers—Moll Model 304</p> <p style="MARGIN: 0px">8.7 Transit Time and Charge Storage 306</p> <p style="MARGIN: 0px">8.8 Small-Signal Model 310</p> <p style="MARGIN: 0px">8.9 Cutoff Frequency 312</p> <p style="MARGIN: 0px">8.10 Charge Control Model 314</p> <p style="MARGIN: 0px">8.11 Model for Large-Signal Circuit Simulation 316</p> <p style="MARGIN: 0px">8.12 Chapter Summary 318</p> <p style="MARGIN: 0px">PROBLEMS 319</p> <p style="MARGIN: 0px">REFERENCES 323</p> <p style="MARGIN: 0px">GENERAL REFERENCES 323</p> <p style="MARGIN: 0px">Appendix I</p> <p style="MARGIN: 0px">Derivation of the Density of States 325</p> <p style="MARGIN: 0px">Appendix II</p> <p style="MARGIN: 0px">Derivation of the Fermi—Dirac Distribution Function 329</p> <p style="MARGIN: 0px">Appendix III</p> <p style="MARGIN: 0px">Self-Consistencies of Minority Carrier Assumptions 333</p> <p style="MARGIN: 0px">Answers to Selected Problems 337</p> <p style="MARGIN: 0px">Index 341</p>