Gerhard Fettweis,
Ibrahim (Abe) M. Elfadel,
Ibrahim M. Elfadel
3D Stacked Chips
From Emerging Processes to Heterogeneous Systems
Paperback Engels 2018 9783319793054Levertijd ongeveer 9 werkdagen
Gratis verzonden
Samenvatting
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
Specificaties
ISBN13:9783319793054
Taal:Engels
Bindwijze:Paperback
Uitgever:Springer International Publishing
Hoofdrubriek:Wetenschap en techniek, Computer en informatica
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