Charles Cohn,
Charles Harper
Failure-Free Integrated Circuit Packages
Gebonden Engels 2004 9780071434843Levertijd ongeveer 11 werkdagen
Gratis verzonden
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Inhoudsopgave
Chapter 1 IntroductionChapter 2 Fundamentals of IC Package TechnologiesChapter 3 Device ReliabilityChapter 4 Physics and Chemistry of Failures in Packaged DevicesChapter 5 Strategies for Locating FailuresChapter 6 Failure Analysis TechniquesChapter 7 Examples of Failure Modes Common in Organic IC PackagesChapter 8 Emerging Assembly Materials for IC Packaging Index
Chapter 3 Device ReliabilityChapter 4 Physics and Chemistry of Failures in Packaged DevicesChapter 5 Strategies for Locating FailuresChapter 6 Failure Analysis TechniquesChapter 7 Examples of Failure Modes Common in Organic IC PackagesChapter 8 Emerging Assembly Materials for IC Packaging Index
Chapter 5 Strategies for Locating FailuresChapter 6 Failure Analysis TechniquesChapter 7 Examples of Failure Modes Common in Organic IC PackagesChapter 8 Emerging Assembly Materials for IC Packaging Index
Chapter 7 Examples of Failure Modes Common in Organic IC PackagesChapter 8 Emerging Assembly Materials for IC Packaging Index
Index
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