Jennie Hwang
Implementing Lead-Free Electronics
Gebonden Engels 2005 9780071443746Levertijd ongeveer 11 werkdagen
Gratis verzonden
Samenvatting
By June 2006 any company selling electronics into the European Union and China will have to convert to lead-free manufacturing processes
Virtually every electronics manufacturer in the world is faced with an expensive revamp of their operations.
This book shows them how to choose the right Lead-Free processes and make the conversion as efficiently and inexpensively as possible.
Specificaties
Lezersrecensies
Wees de eerste die een lezersrecensie schrijft!
Inhoudsopgave
Chapter 1: IntroductionChapter 2: Manufacturing Implementation ApproachesChapter 3: Selecting Lead-Free Alloys for Solder InterconnectionsChapter 4: Applying Solder PasteChapter 5: Selecting Component Coating and PCB Surface FinishChapter 6: Applying Mass Reflow SolderingChapter 7: Wave Soldering and Selective SolderingChapter 8: Compatibility and Cost ConsiderationsChapter 9: Other Manufacturing and Common Production Defect ConsiderationsChapter 10: Reliability and Accelerated Temperature Cycling Tests
Chapter 3: Selecting Lead-Free Alloys for Solder InterconnectionsChapter 4: Applying Solder PasteChapter 5: Selecting Component Coating and PCB Surface FinishChapter 6: Applying Mass Reflow SolderingChapter 7: Wave Soldering and Selective SolderingChapter 8: Compatibility and Cost ConsiderationsChapter 9: Other Manufacturing and Common Production Defect ConsiderationsChapter 10: Reliability and Accelerated Temperature Cycling Tests
Chapter 5: Selecting Component Coating and PCB Surface FinishChapter 6: Applying Mass Reflow SolderingChapter 7: Wave Soldering and Selective SolderingChapter 8: Compatibility and Cost ConsiderationsChapter 9: Other Manufacturing and Common Production Defect ConsiderationsChapter 10: Reliability and Accelerated Temperature Cycling Tests
Chapter 7: Wave Soldering and Selective SolderingChapter 8: Compatibility and Cost ConsiderationsChapter 9: Other Manufacturing and Common Production Defect ConsiderationsChapter 10: Reliability and Accelerated Temperature Cycling Tests
Chapter 9: Other Manufacturing and Common Production Defect ConsiderationsChapter 10: Reliability and Accelerated Temperature Cycling Tests
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