Hengyun Zhang,
Hengyun (Shanghai University of Engineering Science, China) Zhang,
Faxing Che,
Faxing Che Author,
Faxing (Institute of Microelectronics (IME), Agency for Science, Technology and Research (A-STAR), Singapore) Che,
Tingyu Lin,
Tingyu (National Centre for Advanced Packaging (NCAP), China) Lin,
Wensheng Zhao,
Wensheng (Hangzhou Dianzi University, Hangzhou, China) Zhao
e.a.
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
Paperback Engels 2019 9780081025321Levertijd ongeveer 9 werkdagen
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Samenvatting
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.
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Inhoudsopgave
1. Introduction<br>2. Electrical modeling and design<br>3. Thermal modeling, analysis, and design <br>4. Stress and reliability analysis for interconnects <br>5. Reliability and failure analysis of encapsulated packages <br>6. Thermal and mechanical tests for packages and materials<br>7. System-level modeling, analysis, and design
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