Interconnects in VLSI Design

Recent Development in Interconnect Modeling.- Study of Parallel Plane Mode Excitation at a Double-Layer Via Interconnect Using the FDTD Method.- A Testchip for Analysis of Signal Integrity and Ground-Bounce Effects in Deep-Submicron Technology.- Measurement of Signal Integrity within Deep-Submicron Interconnect.- Considering Magnetic Interference in Board-Level Interconnect Design.- Input Shape Influence over Interconnect Performances.- Comparison of RL and RLC Interconnect Models in the Simultaneous Switching Noise Simulations.- Black-Box Modeling of Digital Devices>.- Advanced Modeling of Nonuniform Interconnects.- Modeling of Passive Components for Radio Frequency Applications.- Electrical Performance of Capacitors Integrated in Multi-Layered Printed Circuit Boards.- Characteristic Impedance Measurement on Silicon.- Efficient Computation of the Parameters of Parallel Transmission Lines in IC Interconnects.- Modeling of Optical Interconnections for Data Transmission within High-Speed Electronic Systems.- Quantifying the Impact of Optical Interconnect Latency on the Performance of Optoelectronic FPGA’s.- PIN CMOS Receivers for Optical Interconnects.- BICMOS Receiver OEIC for Optical Interconnect.- Electrical/Optical Circuit Boards: Technology - Design - Modeling.