Adhesion in Microelectronics

<p>Preface&nbsp;xiii<br /> <br /> Acknowledgements&nbsp;xvi<br /> <br /> Part 1: Adhesion: Fundamentals and Measurement<br /> <br /> 1 Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy, with Special Reference to&nbsp; Microelectronics&nbsp;3<br /> Robert R. Mallik<br /> <br /> 1.1 Introduction&nbsp;3<br /> <br /> 1.2 Principles of IETS&nbsp;6<br /> <br /> 1.3 Application of IETS in Microelectronics&nbsp;13<br /> <br /> 1.4 Prospects&nbsp;24<br /> <br /> 1.5 Summary&nbsp;26<br /> <br /> References&nbsp;27<br /> <br /> 2 Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics&nbsp;33<br /> Wei–Sheng Lei and Ajay Kumar<br /> <br /> 2.1&nbsp;Introduction&nbsp;33<br /> <br /> 2.2 Mechanical Methods&nbsp;36<br /> <br /> 2.3 Laser Based Techniques&nbsp;51<br /> <br /> 2.4 Summary and Remarks&nbsp;56<br /> <br /> References&nbsp;59<br /> <br /> Part 2: Ways to Promote/Enhance Adhesion<br /> <br /> 3 Tailoring of Interface/Interphase to Promote Metal–Polymer Adhesion&nbsp;67<br /> J&ouml;rg Friedrich<br /> <br /> 3.1 Introduction&nbsp;67<br /> <br /> 3.2 New Concepts for Ideal Design of Metal–Polymer Interfaces with Covalently Bonded Flexible Spacer Molecules&nbsp;87<br /> <br /> 3.3 Situation at Al Oxide/Hydroxide Surfaces Using Aluminium as Substrate&nbsp;92<br /> <br /> 3.4. Adhesion Promotion by Non–specific Functionalization of Polyolefin Surfaces&nbsp;94<br /> <br /> 3.5 Methods for Producing Monosort Functional Groups at Polyolefin Surfaces&nbsp;103<br /> <br /> 3.6 Reactions and Bond Formation at the Interface&nbsp;110<br /> <br /> 3.7 Grafting of Spacer Molecules at Polyolefin Surfaces&nbsp;112<br /> <br /> 3.8 Summary and Conclusions&nbsp;121<br /> <br /> Acknowledgement&nbsp;123<br /> <br /> References&nbsp;123<br /> <br /> 4 Atmospheric and Vacuum Plasma Treatments of Polymer Surfaces for Enhanced Adhesion in Microelectronics Packaging&nbsp;137<br /> Hang Yu, Yiyuan Zhang, Anita Wong, Igor M. De Rosa, Han S. Chueh, Misha Grigoriev, Thomas S. Williams, Tommy Hsu, and Robert F. Hicks<br /> <br /> 4.1 Introduction&nbsp;137<br /> <br /> 4.2 Plasma Fundamentals&nbsp;139<br /> <br /> 4.3 Survey of Vacuum Plasma Treatment of Polymers&nbsp;146<br /> <br /> 4.4 Survey of Atmospheric Pressure Plasma Treatment of Polymers&nbsp;151<br /> <br /> 4.5 Atmospheric Pressure Plasma Activation of Polymer Materials Relevant to Microelectronics&nbsp;153<br /> <br /> 4.6 Vacuum Versus Atmospheric Plasmas for Use in&nbsp; Semiconductor Packaging&nbsp;165<br /> <br /> References&nbsp;166<br /> <br /> 5 Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications&nbsp;173<br /> James E. Morris and Liang Wang<br /> <br /> 5.1 Introduction&nbsp;173<br /> <br /> 5.2 ICA Technology&nbsp;174<br /> <br /> 5.3 Technology Reviews&nbsp;176<br /> <br /> 5.4 Electrical Properties&nbsp;176<br /> <br /> 5.5 Mechanical Properties&nbsp;180<br /> <br /> 5.6 Thermal Properties&nbsp;181<br /> <br /> 5.7 Metallic Filler&nbsp;181<br /> <br /> 5.8 Polymer Materials&nbsp;184<br /> <br /> 5.9 Reliability&nbsp;186<br /> <br /> 5.10 Dispensation&nbsp;188<br /> <br /> 5.11 Environmental Properties&nbsp;189<br /> <br /> 5.12 Other Results&nbsp;189<br /> <br /> 5.13 Summary&nbsp;190<br /> <br /> 5.14 Prospects&nbsp;190<br /> <br /> References&nbsp;191<br /> <br /> Part 3: Reliability and Failure Mechanisms<br /> <br /> 6 Role of Adhesion Phenomenon in the Reliability of Electronic Packaging&nbsp;213<br /> Puligandla&nbsp; Viswanadham<br /> <br /> 6.1 Introduction&nbsp;214<br /> <br /> 6.2 Hierarchy of Electronic Packaging.&nbsp;216<br /> <br /> 6.3 Substrates, Carriers, and Laminates&nbsp;217<br /> <br /> 6.4 Flexible Laminates&nbsp;236<br /> <br /> 6.5 First Level Packaging /Semiconductor Packaging&nbsp;237<br /> <br /> 6.6 Second Level Packaging&nbsp;247<br /> <br /> 6.7 Reliability Enhancements&nbsp;256<br /> <br /> 6.8 Thermal Management&nbsp;260<br /> <br /> 6.9 Summary&nbsp;261<br /> <br /> Acknowledgements 262<br /> <br /> References 252<br /> <br /> Suggested&nbsp;Reading 262<br /> <br /> References 262<br /> <br /> 7 Delamination and Reliability Issues in Packaged Devices&nbsp;267<br /> Wei–Sheng Lei and Ajay Kumar<br /> <br /> 7.1 Introduction&nbsp;267<br /> <br /> 7.2 Basic Aspects of Delamination Failure&nbsp;269<br /> <br /> 7.3 Evaluation of Delamination Initiation in Electronic Packages&nbsp;280<br /> <br /> 7.4 Evaluation of Delamination Propagation in Electronic Packages&nbsp;290<br /> <br /> 7.5 Summary&nbsp;304<br /> <br /> References&nbsp;305<br /> <br /> 8 Investigation of the Mechanisms of Adhesion and Failure in Microelectronic Packages&nbsp;313<br /> Tanweer Ahsan and Andrew Schoenberg<br /> <br /> 8.1 Introduction 313<br /> <br /> 8.2 Thermal Methods of Characterizatio 314<br /> <br /> 8.3 Stresses in Encapsulated Devices 320<br /> <br /> 8.4 More on Adhesion of Molding Compounds – Surface Chemical and Morphological Aspects 332<br /> <br /> 8.5 Summary 337<br /> <br /> References 338</p>