Ho-Ming Tong,
Yi-Shao Lai,
C.P. Wong
Advanced Flip Chip Packaging
Gebonden Engels 2013 2013e druk 9781441957672Levertijd ongeveer 9 werkdagen
Gratis verzonden
Samenvatting
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Specificaties
ISBN13:9781441957672
Taal:Engels
Bindwijze:gebonden
Aantal pagina's:560
Uitgever:Springer US
Druk:2013
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Inhoudsopgave
<p>Flip Chip Technology Overview and Early Beginnings.- Technology Trends of Flip Chip.- Bumping Technologies.- Flip-Chip Interconnections: Past, Present and Future.- Underfill.- Conductive Adhesives for Flip Chip Applications.- Enabling Substrate Technologies: Past, Present and Future.- IC-Package-System Integrated Design.- Thermal Management of Flip Chip Packages.- Thermo-Mechanical Reliability in Flip Chip Packages.- Interfacial Reactions and Electromigration in Flip-Chip Solder Joints.</p>
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