Kazuo Kondo,
Morihiro Kada,
Kenji Takahashi
Three-Dimensional Integration of Semiconductors
Processing, Materials, and Applications
Paperback Engels 2019 9783319792552Levertijd ongeveer 9 werkdagen
Gratis verzonden
Samenvatting
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
Specificaties
ISBN13:9783319792552
Taal:Engels
Bindwijze:paperback
Uitgever:Springer International Publishing
Lezersrecensies
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Inhoudsopgave
Research and Development History of Three Dimensional (3D) Integration Technology.- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology.- TSV Processes.- Wafer and Die Bonding Processes.- Metrology and Inspection.- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability.- Trends in 3D Integrated Circuit (3D-IC) Testing Technology.- Dream Chip Project at ASET.
Rubrieken
- advisering
- algemeen management
- coaching en trainen
- communicatie en media
- economie
- financieel management
- inkoop en logistiek
- internet en social media
- it-management / ict
- juridisch
- leiderschap
- marketing
- mens en maatschappij
- non-profit
- ondernemen
- organisatiekunde
- personal finance
- personeelsmanagement
- persoonlijke effectiviteit
- projectmanagement
- psychologie
- reclame en verkoop
- strategisch management
- verandermanagement
- werk en loopbaan